BSP
Brush Scrub Processor
A single type brush scrub processor for a surface treatment and a treatment on both sides that supports multiple wafer sizes
It allows customers to perform a treatment on both sides with roll brush and surface treatment with two-fluids.
This achieves processing of wafers with different diameters (4 inch/6 inch or 6 inch/8 inch) without changing setup. It is also applicable to particle removal before wafer loading in the MEMS and LED fields.
Features
| Contamination Control in Scrubbing Unit | Separately cleaning in each process allows customers to prevent contamination by configuring the L/D and scrubbing units as a two-line system |
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| Flexible Choice of Brushes | In addition to PVA brushes, urethane brushes, etc. can be chosen. Capable of processing wafers with different diameters |
| Handling Wafers with Different Diameters | Capable of changing of wafer size between 4 inch / 6 inch and 6 inch / 8 inch without setup changes |
| High Throughput by Simultaneous Cleaning of Both Sides | Higher throughput than conventional scrubbers, allowed by simultaneously cleaning the front and back sides |
| Diverse Process Selection | Available for options to select the spin unit, such as two-fluid JET and megasonic cleaning |
Supported processes
Particle Removal / Post-CMP Cleaning for Slurry Removal