FLO
Flash Spray System Lift-off Equipment
A spray-type single lift-off processor that achieves a high throughput while saving chemicals
The unique chamber offers a small footprint, low chemical consumption, low cost, and high throughput.
The three-stage recovery structure successfully increases the metal recovery efficiency.
The stripping section processes are performed with the minimum amount of chemicals required because of no need of reserving chemicals in it.
Features
| Damage-less Stripping | Damage-less stripping method by spraying |
|---|---|
| Supporting Thin Wafers | Supporting up to 200 µm thickness by adopting special reinforcement plates |
| Smaller Footprint | Simplified treatment process is achieved |
| Prevention of Sludge Reattachment | Centrifugal force-based liquid removal system is adopted |
| A Variety of Treatment Methods | Combinations of high-pressure cleaning and chemical treatment are available in addition to the two-fluid JET cleaning |
Supported processes
Lift-Off / Resist Stripping / Polymer Removal / Particle Removal