SLO Single Wafer Lift-Off Equipment │ Semiconductor Cleaning Equipment / MEMS Cleaning Equipment / Wet Station/ Semiconductor Manufacturing Equipment │ DAIKIN FINETECH

SLO

Single Wafer Lift-Off Equipment

Single wafer lift-off equipment to perform wafer stripping treatment while dipping

The combination of swelling and oscillation enhances the stripping power.
The down-flow system in the tank ensures to remove sludge and prevent retention in the tank to prevent reattachment. The highly efficient sludge collection system completely separates the chemicals in the circulation line from the sludge.

Features

Improvement in Yield	Stabilizing the lift-off performance, ensured by the combination of vertical dipping and horizontal spin
High Throughput	Achieved by optimizing the treatment tank layout and the conveyance mechanism
Improvement in Sludge Removal Performance	Centrifugal separation sludge collection system is adopted
Precision Finish Cleaning Mechanism	Compatible with three types of nozzle systems (two-fluid JET, megasonic, high pressure nozzles)
Supporting Thin Wafers	Support mechanism Supporting thin wafers