Wafer Dryer
Spin Dryer
Cleaning process parts, reflecting our know-how of cleaning equipment manufacturing cultivated in the cutting-edge processes
Our originally developed wafer damage-less system eliminates the concerns about wafer cracking and pattern collapse in the spin drying to the utmost extent.
This supports a wide range of workpiece sizes of 3 inches to 8 inches with thicknesses 150 µm to 725 µm.
Optional auto balancer control is available for short time drying.
Features
| Abundant Lineup | Supporting a wide range of wafer sizes and the type can be selected between manual type and in-line type |
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| Measures for Contamination | Prevention of contamination in the sliding section, adopting a special seal structure in the bearing section |
| Reduction in Wafer Stress | Damage-less system is developed to reduce stress on the fragile wafers (available as an option) |