CLO
Cup Type Single Wafer Lift-Off Equipment
Single wafer lift-off processor with stability and stripping power
Despite of being a single-wafer type, completely dipping wafers in chemicals ensures the liquid temperature stability, ultrasonic attachability, and ultrasonic efficiency that could not be achieved with conventional single-wafer systems, thereby greatly improving the lift-off efficiency.
Features
| Special Shape of Chamber | Swelling and spinning allowed by the cup shape |
|---|---|
| Precision Finish Cleaning | Damage-less and precision finishing allowed by flash spray |
| Prevention of Reattachment | Centrifugal force-based liquid removal system is adopted |
Supported processes
Lift-Off / Resist Stripping / Polymer Removal / Particle Removal